Invention Grant
- Patent Title: Image sensor device with submicron structure
- Patent Title (中): 具有亚微米结构的图像传感器
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Application No.: US12039540Application Date: 2008-02-28
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Publication No.: US07875949B2Publication Date: 2011-01-25
- Inventor: Hsiao-Wen Lee
- Applicant: Hsiao-Wen Lee
- Applicant Address: TW Hsinchu Science Park
- Assignee: VisEra Technologies Company Limited
- Current Assignee: VisEra Technologies Company Limited
- Current Assignee Address: TW Hsinchu Science Park
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L31/075
- IPC: H01L31/075

Abstract:
An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel region and at least one integrated circuit in the substrate of the pixel region. A photodiode is disposed on the substrate of the pixel region, comprising a lower electrode, a transparent upper electrode and a photoelectric conversion layer. The lower electrode is disposed on the substrate and is electrically connected to the integrated circuit. The photoelectric conversion layer is disposed on the lower electrode and has a submicron structure therein. The transparent upper electrode is disposed on the photoelectric conversion layer.
Public/Granted literature
- US20090218650A1 IMAGE SENSOR DEVICE WITH SUBMICRON STRUCTURE Public/Granted day:2009-09-03
Information query
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