Invention Grant
- Patent Title: Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same
- Patent Title (中): 封装基板包括安装在其外围表面上的表面安装部件和包括其的微电子封装
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Application No.: US11851547Application Date: 2007-09-07
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Publication No.: US07875973B2Publication Date: 2011-01-25
- Inventor: Chia-Pin Chiu
- Applicant: Chia-Pin Chiu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.
Public/Granted literature
Information query
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