Invention Grant
US07875975B2 Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
失效
有机集成电路完全由多层屏障封装并包含在RFID标签中
- Patent Title: Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
- Patent Title (中): 有机集成电路完全由多层屏障封装并包含在RFID标签中
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Application No.: US10344926Application Date: 2001-08-17
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Publication No.: US07875975B2Publication Date: 2011-01-25
- Inventor: Adolf Bernds , Wolfgang Clemens , Walter Fix , Henning Rost
- Applicant: Adolf Bernds , Wolfgang Clemens , Walter Fix , Henning Rost
- Applicant Address: DE Furth
- Assignee: PolyIC GmbH & Co. KG
- Current Assignee: PolyIC GmbH & Co. KG
- Current Assignee Address: DE Furth
- Agency: Carella, Byrne et al.
- Agent Elliot M. Olstein; Willaim Squire
- Priority: DE10040442 20000818; DE10120685 20010427; DE10120687 20010427
- International Application: PCT/DE01/03164 WO 20010817
- International Announcement: WO02/15264 WO 20020221
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31
Abstract:
An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.
Public/Granted literature
- US20040026689A1 Encapsulated organic-electronic component, method for producing the same and use thereof Public/Granted day:2004-02-12
Information query
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