Invention Grant
- Patent Title: Seal having an IC tag and method of attaching the same
- Patent Title (中): 具有IC标签的密封件和附接IC标签的方法
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Application No.: US11703816Application Date: 2007-02-08
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Publication No.: US07876221B2Publication Date: 2011-01-25
- Inventor: Masahide Tanaka , Masataka Fujii , Takashi Fujihara , Toshibumi Imai
- Applicant: Masahide Tanaka , Masataka Fujii , Takashi Fujihara , Toshibumi Imai
- Applicant Address: JP Kyoto JP Tokyo JP Tokyo
- Assignee: Suncall Corporation,Toppan Printing Co., Ltd.,Hitachi, Ltd.
- Current Assignee: Suncall Corporation,Toppan Printing Co., Ltd.,Hitachi, Ltd.
- Current Assignee Address: JP Kyoto JP Tokyo JP Tokyo
- Priority: JP2004-231978 20040809
- Main IPC: G08B13/14
- IPC: G08B13/14
Abstract:
The seal having an IC tag is to be attached to cover a bordering part between the cover and main body of a container. The seal has a base member serving as a support, an antenna provided on one surface of the base member and having a slit, an IC chip connected to the antenna and provided on the antenna, and an adhesive layer provided on that surface of the base-member on which the antenna and the IC chip are provided. The method of attaching a seal having an IC tag is to attach the antenna by using the adhesive layer, so that the seal may overlap both the cover and the main body of the container.
Public/Granted literature
- US20070139205A1 Seal having an IC tag and method of attaching the same Public/Granted day:2007-06-21
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