Invention Grant
- Patent Title: Mounting apparatus for motherboard
- Patent Title (中): 主板安装装置
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Application No.: US12106338Application Date: 2008-04-21
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Publication No.: US07876569B2Publication Date: 2011-01-25
- Inventor: Yuan Xue
- Applicant: Yuan Xue
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200820300345U 20080313
- Main IPC: H05K7/12
- IPC: H05K7/12

Abstract:
A mounting apparatus for a motherboard includes a chassis and a mounting assembly for securing the motherboard in the chassis. The mounting assembly includes a pivot member pivotally attached to the chassis and a limiting member securely attached to the chassis. The pivot member is rotatable from a released position disengaging from the motherboard to a final position resisting against the motherboard for preventing the motherboard sliding from a secured position to a detachable position. The limiting member includes a resilient arm. A resisting piece extends from the resilient arm and engages with the pivot member to prevent the pivot member rotating from the final position to the released position.
Public/Granted literature
- US20090231817A1 MOUNTING APPARATUS FOR MOTHERBOARD Public/Granted day:2009-09-17
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