Invention Grant
- Patent Title: Substrate housing container
- Patent Title (中): 基材容器
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Application No.: US12147045Application Date: 2008-06-26
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Publication No.: US07876575B2Publication Date: 2011-01-25
- Inventor: Kohei Hosokawa
- Applicant: Kohei Hosokawa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-169248 20070627
- Main IPC: H05K7/18
- IPC: H05K7/18 ; H05K7/14

Abstract:
The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate. In accordance with the present invention, it is possible to provide a substrate housing container which is able to hold the wafer in a predetermined position even in a case in which the substrate housing container is moved in which a lid body is released.
Public/Granted literature
- US20090002966A1 SUBSTRATE HOUSING CONTAINER Public/Granted day:2009-01-01
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