Invention Grant
- Patent Title: Method and system for issuing letters of credit
- Patent Title (中): 签发信用证的方法和制度
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Application No.: US11019376Application Date: 2004-12-22
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Publication No.: US07877324B2Publication Date: 2011-01-25
- Inventor: Rick Caplan , Marcy Engel , Steve Incontro , Stanley Louie , Frank Pertusiello
- Applicant: Rick Caplan , Marcy Engel , Steve Incontro , Stanley Louie , Frank Pertusiello
- Applicant Address: US NY New York
- Assignee: Citigroup Global Markets, Inc.
- Current Assignee: Citigroup Global Markets, Inc.
- Current Assignee Address: US NY New York
- Agency: Milbank, Tweed, Hadley & McCloy LLP
- Main IPC: G06Q40/00
- IPC: G06Q40/00
Abstract:
A system and method for issuing letters of credit. The system and method issue a first letter of credit from a second party to a third party, and issue at least one second letter of credit from the third party to at least one fourth party. The system and method also provide a credit facility from the second party to a first party, the credit facility associated with the first and second letters of credit. The system and method also transfer credit risk from the credit facility to at least one fifth party under a participation agreement.
Public/Granted literature
- US20060136331A1 Method and system for issuing letters of credit Public/Granted day:2006-06-22
Information query
