Invention Grant
- Patent Title: Method for positioning and joining panels
- Patent Title (中): 定位和连接面板的方法
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Application No.: US11691552Application Date: 2007-03-27
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Publication No.: US07877850B2Publication Date: 2011-02-01
- Inventor: Pei-Chung Wang , Roland J. Menassa , James W. Wells , John D. Fickes , Tommy Christensen
- Applicant: Pei-Chung Wang , Roland J. Menassa , James W. Wells , John D. Fickes , Tommy Christensen
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Main IPC: B23Q3/00
- IPC: B23Q3/00

Abstract:
A method is provided for precisely positioning and joining first and second sheet panels. A first hole is extruded in the first panel with an annular upstanding wall surrounding the first hole. The first hole has a diameter to fit closely over the locating pin of a support. A second hole is formed in the second panel and has a diameter to fit closely over the annular upstanding wall of the first panel. A bond is created between the first and second panels adjacent to the annular upstanding wall, so that the annular upstanding wall protects the locating pin from being fouled by the bonding material. The bond may be either an adhesive bond or an electric resistance weld or both an adhesive bond and an electric resistance weld and the annular upstanding wall acts as a dam to protect the locating pin from the adhesive or weld splatter.
Public/Granted literature
- US20080235932A1 Method for positioning and joining panels Public/Granted day:2008-10-02
Information query
IPC分类: