Invention Grant
- Patent Title: Method of fabricating circuit configuration member
- Patent Title (中): 制造电路配置元件的方法
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Application No.: US11790404Application Date: 2007-04-25
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Publication No.: US07877868B2Publication Date: 2011-02-01
- Inventor: Tadashi Tomikawa , Tomoki Kanou
- Applicant: Tadashi Tomikawa , Tomoki Kanou
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-306180 20030829
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/28 ; H05K7/20
Abstract:
A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.
Public/Granted literature
- US20070195504A1 Circuit configuration member and method of fabricating the same Public/Granted day:2007-08-23
Information query
