Invention Grant
- Patent Title: Device and method for on-die temperature measurement
- Patent Title (中): 用于管芯温度测量的装置和方法
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Application No.: US11025140Application Date: 2004-12-30
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Publication No.: US07878016B2Publication Date: 2011-02-01
- Inventor: Efraim Rotem , Jim G. Hermerding , Eric Distefano , Barnes Cooper
- Applicant: Efraim Rotem , Jim G. Hermerding , Eric Distefano , Barnes Cooper
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak PLLC
- Main IPC: F25D23/12
- IPC: F25D23/12 ; G01K1/08 ; G06F1/00

Abstract:
A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
Public/Granted literature
- US20060149974A1 Device and method for on-die temperature measurement Public/Granted day:2006-07-06
Information query
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