A temperature compensating pressure sensor arrangement includes a capacitive pressure sensor having a substrate carrying CMOS layers. A conductive membrane is arranged on the substrate and defines a reference chamber such that capacitance changes resulting from displacement of the conductive membrane can be converted to pressure change values. A cap covers the conductive membrane and has openings to permit pressure changes to be detected by the conductive membrane. A capacitive temperature sensor is operatively arranged with respect to the capacitive pressure sensor and has a conductive membrane arranged on the substrate and defines a reference chamber such that capacitance changes resulting from displacement of the conductive membrane can be converted to temperature change values. The conductive member defining openings and cap covers and seals the conductive membrane from an external environment.