Invention Grant
US07878117B2 Stencil printing apparatus having controlled thermal head for perforating stencil
有权
具有用于穿孔模板的受控热头的模板印刷装置
- Patent Title: Stencil printing apparatus having controlled thermal head for perforating stencil
- Patent Title (中): 具有用于穿孔模板的受控热头的模板印刷装置
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Application No.: US12026047Application Date: 2008-02-05
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Publication No.: US07878117B2Publication Date: 2011-02-01
- Inventor: Satoshi Katoh , Kengo Tsubaki
- Applicant: Satoshi Katoh , Kengo Tsubaki
- Applicant Address: JP Shibata-gun
- Assignee: Tohoku Ricoh Co., Ltd.
- Current Assignee: Tohoku Ricoh Co., Ltd.
- Current Assignee Address: JP Shibata-gun
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-149677 20070605
- Main IPC: B41L13/04
- IPC: B41L13/04 ; B41J3/24

Abstract:
A stencil printing apparatus with a plate-making device has first control means for executing a special plate-making mode for performing a plate-making operation so that perforated holes to be formed in a film of a master by heating and driving with regard to odd bits corresponding to odd-numbered heat generators and even bits corresponding to even-numbered heat generators are formed in different lines running in the main scanning direction, and so that the perforated holes to be formed on the film by heating and driving with regard to the odd bits and the even bits adjacent to each other are not arranged adjacent to each other in the same line in the main scanning direction.
Public/Granted literature
- US20080302259A1 STENCIL PRINTING APPARATUS Public/Granted day:2008-12-11
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