Invention Grant
- Patent Title: Electroless plating apparatus and electroless plating method
- Patent Title (中): 无电镀设备和化学镀方法
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Application No.: US11585957Application Date: 2006-10-25
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Publication No.: US07878144B2Publication Date: 2011-02-01
- Inventor: Akira Owatari , Yasuhiko Saijo , Junichiro Tsujino
- Applicant: Akira Owatari , Yasuhiko Saijo , Junichiro Tsujino
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack L.L.P.
- Priority: JP2005-310033 20051025; JP2006-273159 20061004
- Main IPC: B05C3/02
- IPC: B05C3/02 ; B05D1/18
Abstract:
An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.
Public/Granted literature
- US20070092658A1 Electroless plating apparatus and electroless plating method Public/Granted day:2007-04-26
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