Invention Grant
- Patent Title: Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
- Patent Title (中): 具有用于热管理的热超导传热介质的发光芯片装置
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Application No.: US10887601Application Date: 2004-07-09
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Publication No.: US07878232B2Publication Date: 2011-02-01
- Inventor: Mehmet Arik , Stanton Earl Weaver, Jr.
- Applicant: Mehmet Arik , Stanton Earl Weaver, Jr.
- Applicant Address: US OH Cleveland
- Assignee: GE Lighting Solutions, LLC
- Current Assignee: GE Lighting Solutions, LLC
- Current Assignee Address: US OH Cleveland
- Agency: Fay Sharpe LLP
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/00 ; F21V29/00
Abstract:
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.
Public/Granted literature
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