Invention Grant
- Patent Title: Subframe-locating device
- Patent Title (中): 子框架定位装置
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Application No.: US11635650Application Date: 2006-12-08
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Publication No.: US07878287B2Publication Date: 2011-02-01
- Inventor: Joe L. Buchwitz , Tim D. Smith
- Applicant: Joe L. Buchwitz , Tim D. Smith
- Applicant Address: US MI Dearborn
- Assignee: Ford Motor Company
- Current Assignee: Ford Motor Company
- Current Assignee Address: US MI Dearborn
- Agency: O'Brien Jones, PLLC
- Main IPC: B62D21/00
- IPC: B62D21/00

Abstract:
The invention relates to a device for locating a subframe to a vehicle body having a control hole. The device comprises a pin attached to the subframe and extending toward the vehicle body when the subframe is positioned for mounting to the vehicle body. The pin is adapted to engage the control hole to precisely align the subframe and the vehicle body. The invention also relates to a method for locating a subframe to a vehicle body having a control hole. The method comprises providing a pin on the subframe that extends toward the vehicle body when the subframe is positioned for mounting to the vehicle body, and engaging the pin with the control hole to precisely align the subframe and the vehicle body. The present invention further relates to a method for manufacturing a subframe, comprising manufacturing a subframe having one or more bosses adapted to retain locating pins, and inserting locating pins into the one or more bosses so that the locating pins extend toward a vehicle body when the subframe is positioned for mounting to the vehicle body.
Public/Granted literature
- US20080134490A1 Subframe-locating device Public/Granted day:2008-06-12
Information query
IPC分类: