Invention Grant
- Patent Title: System and method for inspection of chips on tray
- Patent Title (中): 托盘上芯片检查的系统和方法
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Application No.: US12555245Application Date: 2009-09-08
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Publication No.: US07878336B2Publication Date: 2011-02-01
- Inventor: Cheng Tao Tsai , Chao Sheng Yu
- Applicant: Cheng Tao Tsai , Chao Sheng Yu
- Applicant Address: TW Hsinchu County
- Assignee: Cheng Mei Instrument Technology Co., Ltd.
- Current Assignee: Cheng Mei Instrument Technology Co., Ltd.
- Current Assignee Address: TW Hsinchu County
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: B07C5/344
- IPC: B07C5/344

Abstract:
A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.
Public/Granted literature
- US20100063619A1 SYSTEM AND METHOD FOR INSPECTION OF CHIPS ON TRAY Public/Granted day:2010-03-11
Information query