A blister pack system has an upper part and a bottom part, between which a blister pack is disposed. Pouches of the blister pack are aligned with corresponding ejection openings of the upper part and corresponding ejection openings of the bottom part. Every ejection opening of the upper part is associated with an individual contact surface that can be connected to a control/computing unit via an individual strip conductor. The system includes an ejection device, which at a top section has an electrical contact, and at a peg section an additional electrical contact which is electrically connected to the electrical contact of the top section. The individual contact surfaces and the individual strip conductors associated therewith, as well as a common contact surface and a common strip conductor associated therewith or a subsection thereof extend in surfaces of the upper part that are electrically isolated from each other.