Invention Grant
- Patent Title: Plate material cutting unit, plate material cutting apparatus equipped with the plate material cutting unit, and plate material cutting system equipped with the plate material cutting apparatus
- Patent Title (中): 板材切割单元,装有板材切割单元的板材切割装置,以及装有板材切割装置的板材切割系统
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Application No.: US11921404Application Date: 2006-06-02
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Publication No.: US07878381B2Publication Date: 2011-02-01
- Inventor: Keiji Tsujita , Hideyuki Tanaka , Morimasa Kuge , Syuichi Nakayama , Susumu Sugiyama
- Applicant: Keiji Tsujita , Hideyuki Tanaka , Morimasa Kuge , Syuichi Nakayama , Susumu Sugiyama
- Applicant Address: JP Tokyo JP Kobe-shi, Hyogo
- Assignee: Corning Japan K.K.,Kawasaki Plant Systems Kabushiki Kaisha
- Current Assignee: Corning Japan K.K.,Kawasaki Plant Systems Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Kobe-shi, Hyogo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2005-162243 20050602
- International Application: PCT/JP2006/311102 WO 20060602
- International Announcement: WO2006/129798 WO 20061207
- Main IPC: C03B33/02
- IPC: C03B33/02

Abstract:
A plate material cutting unit is equipped with: support devices for supporting the lower edge of an upright plate material; fluid guides for applying fluid pressure on a surface of the plate material which is held upright on the support devices, to support the plate material in a non-contact manner; a scribe forming device, equipped with a scribing blade for forming a scribe for cutting on the plate material, by moving along the surface of the plate material, which is supported by the fluid guides; a clamp, for gripping a portion of the plate material adjacent to the movement trajectory of the scribing blade along the plate material; and a cutting device, equipped with a pressing member for pressing a portion of the plate material opposite the scribe in a planar direction with respect to the portion of the plate material which is gripped by the clamp.
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