Invention Grant
US07878386B2 Method and device for heat treatment, especially connection by soldering
有权
用于热处理的方法和装置，特别是通过焊接连接
- Patent Title: Method and device for heat treatment, especially connection by soldering
- Patent Title (中): 用于热处理的方法和装置，特别是通过焊接连接
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Application No.: US12300851Application Date: 2007-04-27
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Publication No.: US07878386B2Publication Date: 2011-02-01
- Inventor: Stefan Weber
- Applicant: Stefan Weber
- Applicant Address: DE Wertheim
- Assignee: Pink GmbH Thermosysteme
- Current Assignee: Pink GmbH Thermosysteme
- Current Assignee Address: DE Wertheim
- Agency: Fredrikson & Byron, P.A.
- Priority: DE102006025193 20060529; DE102006029593 20060626
- International Application: PCT/DE2007/000758 WO 20070427
- International Announcement: WO2007/137547 WO 20071206
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K37/00
Abstract:
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).
Public/Granted literature
- US20090173771A1 METHOD AND DEVICE FOR HEAT TREATMENT, ESPECIALLY CONNECTION BY SOLDERING Public/Granted day:2009-07-09
Information query
IPC分类:
