Invention Grant
- Patent Title: Audio component mounting system
- Patent Title (中): 音频组件安装系统
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Application No.: US12629277Application Date: 2009-12-02
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Publication No.: US07878566B2Publication Date: 2011-02-01
- Inventor: Brian Boggess , Matthew Seman
- Applicant: Brian Boggess , Matthew Seman
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Plumsea Law Group, LLC
- Agent Mark E. Duell
- Main IPC: B60R11/02
- IPC: B60R11/02 ; B60R21/045
Abstract:
A mounting system for motor vehicle audio components is described. The mounting system comprises a chassis and at least one vibration damping element. The vibration damping element is mounted within the chassis in a position to support and secure an audio component. The vibration damping element has a slot receiving a fastener that is connected to the audio component. The fastener secures the audio component in a first position and translates along the fastener slot under a predefined load.
Public/Granted literature
- US20100109363A1 Audio Component Mounting System Public/Granted day:2010-05-06
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