Invention Grant
- Patent Title: Maintenance method of fluid ejecting apparatus
- Patent Title (中): 流体喷射装置的维护方法
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Application No.: US12370822Application Date: 2009-02-13
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Publication No.: US07878619B2Publication Date: 2011-02-01
- Inventor: Shuhei Harada
- Applicant: Shuhei Harada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2008-033239 20080214
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A maintenance method of a fluid ejecting apparatus having a fluid ejection head. A cap member faces an ejection region of the ejection head and a portion thereof facing the ejection region covers a space that includes the ejection surface. When the space covered by the cap member is to be uncovered, the facing portion of the cap member is tilted with respect to the ejection head. Fluid is then ejected from a first portion of the ejection region toward a predetermined region of the facing portion. The ejection head is then moved, and a second portion of the ejection region behind the first portion is positioned so as to overlap the predetermined region in a plan view. Fluid is then ejected from the second portion toward the predetermined region, and the potential difference resulting from the ejection of the fluid from the ejection head is detected.
Public/Granted literature
- US20090207206A1 MAINTENANCE METHOD OF FLUID EJECTING APPARATUS Public/Granted day:2009-08-20
Information query
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