Invention Grant
- Patent Title: Light fixture assembly having improved heat dissipation capabilities
- Patent Title (中): 灯具组件具有改善的散热能力
-
Application No.: US11985055Application Date: 2007-11-13
-
Publication No.: US07878692B2Publication Date: 2011-02-01
- Inventor: Daryl Soderman , Dale B. Stepps
- Applicant: Daryl Soderman , Dale B. Stepps
- Applicant Address: US FL Fort Lauderdale
- Assignee: Inteltech Corporation
- Current Assignee: Inteltech Corporation
- Current Assignee Address: US FL Fort Lauderdale
- Agency: Malloy & Malloy, P.A.
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the mounting assembly, wherein both the mounting assembly and the cover structure are formed of conductive material, thereby effectively dissipating the heat generated by the LED illumination assembly. The illumination assembly is connected to a source and electric energy by a conductor assembly comprising one or more conductive material connectors mechanically interconnecting components of the light fixture into an assembled orientation. A non-conductive insulation assembly isolates each of the one or more conductive connectors from the mounting assembly to avoid electrical contact there between.
Public/Granted literature
- US20090122561A1 Light fixture assembly having improved heat dissipation capabilities Public/Granted day:2009-05-14
Information query