Invention Grant
- Patent Title: Electrical floor access module system
- Patent Title (中): 电气地板接入模块系统
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Application No.: US11913493Application Date: 2005-05-03
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Publication No.: US07878845B2Publication Date: 2011-02-01
- Inventor: Norman R. Byrne
- Applicant: Norman R. Byrne
- International Application: PCT/US2005/015172 WO 20050503
- International Announcement: WO2006/118568 WO 20061109
- Main IPC: H02G3/08
- IPC: H02G3/08 ; E04B5/00

Abstract:
An electrical system (500) is positioned beneath an access floor (30) and includes a number of access floor modules (502) for providing electrical power locations for energizing electrical devices. Cable assemblies (578) electrically interconnect the modules (502) to the power source and to each other. Junction blocks (518) are mechanically connected to the access floor modules (502). Electrical receptacle blocks (562) are electrically interconnected to the junction blocks (518) for supplying power to interconnected electrical devices.
Public/Granted literature
- US20090301774A1 ELECTRICAL FLOOR ACCESS MODULE SYSTEM Public/Granted day:2009-12-10
Information query
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