Invention Grant
- Patent Title: Lancet assembly
- Patent Title (中): 柳叶刀组装
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Application No.: US11664821Application Date: 2005-05-17
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Publication No.: US07879059B2Publication Date: 2011-02-01
- Inventor: Teruyuki Abe , Kazuharu Seki
- Applicant: Teruyuki Abe , Kazuharu Seki
- Applicant Address: JP Osaka
- Assignee: Izumi-Cosmo Company, Limited
- Current Assignee: Izumi-Cosmo Company, Limited
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2004-293904 20041006
- International Application: PCT/JP2005/008960 WO 20050517
- International Announcement: WO2006/038340 WO 20060413
- Main IPC: A61B17/32
- IPC: A61B17/32

Abstract:
A lancet assembly is disclosed which eliminates the need for removing a resin cover that covers a pricking element. When a lancet structure is inserted into a lancet holder, a force is applied so as to separate a lancet cover, that encloses a distal end of a pricking element, from a lancet body so that the distal end of the pricking element which has been enclosed by the lancet cover is exposed in the lancet holder, and the opening of the lancet holder is positioned in front of the distal end of the pricking element. The lancet structure has a trigger which launches the pricking element of which the distal end is exposed, when the lancet structure is continually pushed into the lancet holder.
Public/Granted literature
- US20080058847A1 Lancet assembly Public/Granted day:2008-03-06
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