Invention Grant
- Patent Title: Metal encapsulation
- Patent Title (中): 金属封装
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Application No.: US11839257Application Date: 2007-08-15
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Publication No.: US07879131B2Publication Date: 2011-02-01
- Inventor: Zvi Yaniv , Prabhu Soundarrajan
- Applicant: Zvi Yaniv , Prabhu Soundarrajan
- Applicant Address: US TX Austin
- Assignee: Applied Nanotech Holdings, Inc.
- Current Assignee: Applied Nanotech Holdings, Inc.
- Current Assignee Address: US TX Austin
- Agency: Matheson Keys Garsson & Kordzik
- Agent Kelly Kordzik
- Main IPC: B22F9/06
- IPC: B22F9/06 ; B22F9/24

Abstract:
A process for encapsulating metal microparticles in a pH sensitive polymer matrix using a suspension containing the polymer. The process first disperses the metal particles in a polymeric solution consisting of a pH sensitive polymer. The particles are then encapsulated in the form of micro-spheres of about 5-10 microns in diameter comprising the pH sensitive polymer and the metal ions (Ni2+, Cu2+) to be coated. The encapsulated matrix includes first metal particles homogeneously dispersed in a pH sensitive matrix, comprising the second metal ions. A high shear homogenization process ensures homogenization of the aqueous mixture resulting in uniform particle encapsulation. The encapsulated powder may be formed using spray drying. The powder may be then coated in a controlled aqueous media using an electroless deposition process. The polymer is removed when the encapsulated micro-spheres encounter a pH change in the aqueous solution.
Public/Granted literature
- US20080210742A1 METAL ENCAPSULATION Public/Granted day:2008-09-04
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