Invention Grant
- Patent Title: Vacuum processing apparatus
- Patent Title (中): 真空加工设备
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Application No.: US10796344Application Date: 2004-03-09
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Publication No.: US07879149B2Publication Date: 2011-02-01
- Inventor: Yuichiro Ohta
- Applicant: Yuichiro Ohta
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2003-065086 20030311
- Main IPC: C23C16/00
- IPC: C23C16/00 ; G02F1/1339

Abstract:
The vacuum processing apparatus includes a vacuum chamber, a vacuum pump, and a pipe 30 connecting the vacuum chamber to the vacuum pump to evacuate the vacuum chamber. A flexible pipe is included as a part of the pipe, and a mechanism for fixing the flexible pipe so as not to shrink at the time of evacuation. The mechanism includes a bar for fixing the vacuum pump side of the flexible pipe to a floor. In an embodiment, the vacuum processing apparatus is a substrate bonding apparatus for fabricating a display device.
Public/Granted literature
- US20040177810A1 Vacuum processing apparatus Public/Granted day:2004-09-16
Information query
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