Invention Grant
- Patent Title: Method and apparatus for surface processing of a substrate
- Patent Title (中): 用于表面处理基板的方法和装置
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Application No.: US10915745Application Date: 2004-08-11
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Publication No.: US07879201B2Publication Date: 2011-02-01
- Inventor: Boris Druz , Viktor Kanarov , Hariharakeshave S. Hegde , Alan V. Hayes , Emmanuel Lakios
- Applicant: Boris Druz , Viktor Kanarov , Hariharakeshave S. Hegde , Alan V. Hayes , Emmanuel Lakios
- Applicant Address: US NY Woodbury
- Assignee: Veeco Instruments Inc.
- Current Assignee: Veeco Instruments Inc.
- Current Assignee Address: US NY Woodbury
- Agency: Wood, Herron & Evans, LLP
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/32 ; C25B9/00 ; C25B11/00 ; C25B13/00

Abstract:
Method and apparatus for processing a substrate with a beam of energetic particles. The beam is directed from a source through a rectangular aperture in a shield positioned between the source and substrate to a treatment zone in a plane of substrate movement. Features on the substrate are aligned parallel to a major dimension of the rectangular aperture and the substrate is moved orthogonally to the aperture's major dimension. The beam impinges the substrate through the aperture during movement. The substrate may be periodically rotated by approximately 180° to reorient the features relative to the major dimension of the rectangular aperture. The resulting treatment profile is symmetrical about the sides of the features oriented toward the major dimension of the rectangular aperture.
Public/Granted literature
- US20050034979A1 Method and apparatus for surface processing of a substrate Public/Granted day:2005-02-17
Information query
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