Invention Grant
- Patent Title: Method for forming panel units having in situ formed moldings
- Patent Title (中): 用于形成具有原位成形模制件的面板单元的方法
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Application No.: US10986789Application Date: 2004-11-15
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Publication No.: US07879278B2Publication Date: 2011-02-01
- Inventor: Naotaka Hanai , Tomohiro Sakagami , Toshiaki Kakuto , Takanori Tanaka
- Applicant: Naotaka Hanai , Tomohiro Sakagami , Toshiaki Kakuto , Takanori Tanaka
- Applicant Address: JP Aichi-ken
- Assignee: Tokai Kogyo Kabushiki Kaisha
- Current Assignee: Tokai Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Aichi-ken
- Agency: Dennison, Schultz & MacDonald
- Priority: JP2000-384176 20001218
- Main IPC: B29D5/00
- IPC: B29D5/00

Abstract:
Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.
Public/Granted literature
- US20050087907A1 Panel units having in situ formed moldings Public/Granted day:2005-04-28
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