Methods and systems for organic vapor jet deposition are provided, where an exhaust is disposed between adjacent nozzles. One or more carrier gases may be provided and ejected from a plurality of nozzles. An exhaust may be provided to create a localized vacuum between nozzles. The exhaust may reduce pressure buildup in the nozzles and between the nozzles and the substrate, leading to improved deposition profiles, resolution, and improved nozzle-to-nozzle uniformity. The exhaust may be in fluid communication with an ambient vacuum, or may be directly connected to a vacuum source.