Invention Grant
- Patent Title: Resin composition for sealing light emitting device
- Patent Title (中): 用于密封发光装置的树脂组合物
-
Application No.: US11140197Application Date: 2005-05-31
-
Publication No.: US07879405B2Publication Date: 2011-02-01
- Inventor: Satoru Kaji , Taketoshi Usui
- Applicant: Satoru Kaji , Taketoshi Usui
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2004-164717 20040602
- Main IPC: C08G77/14
- IPC: C08G77/14
Abstract:
A curable composition for sealing a light emitting device, comprising a modified polysiloxane containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups.
Public/Granted literature
- US20050272896A1 Resin composition for sealing light emitting device Public/Granted day:2005-12-08
Information query
