Invention Grant
- Patent Title: Substrate warpage-reducing structure
- Patent Title (中): 基体翘曲缩小结构
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Application No.: US12412114Application Date: 2009-03-26
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Publication No.: US07879438B2Publication Date: 2011-02-01
- Inventor: Jyh-Rong Lin , Bin Xie , Yeung Yeung , Xunqing Shi , Chang Hwa Chung
- Applicant: Jyh-Rong Lin , Bin Xie , Yeung Yeung , Xunqing Shi , Chang Hwa Chung
- Applicant Address: HK Shatin, New Territories
- Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Current Assignee Address: HK Shatin, New Territories
- Agency: Berkeley Law & Technology Group, LLP
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
The subject matter disclosed herein relates to methods to reduce warpage of a substrate.
Public/Granted literature
- US20100247879A1 SUBSTRATE WARPAGE-REDUCING STRUCTURE Public/Granted day:2010-09-30
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