Invention Grant
- Patent Title: Sequential lateral solidification mask
- Patent Title (中): 顺序侧面凝固掩模
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Application No.: US11368634Application Date: 2006-03-07
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Publication No.: US07879511B2Publication Date: 2011-02-01
- Inventor: Chih-Wei Chao
- Applicant: Chih-Wei Chao
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW94118439A 20050603
- Main IPC: G03F1/00
- IPC: G03F1/00
Abstract:
A mask used in a sequential lateral solidification process to fabricate a multi-boundary polysilicon. The mask comprises a first portion, a second portion and a third portion. The first and the third portions are translucent to light, and the second portion is opaque. These three portions have the same shape but different sizes. The first portion surrounds the second portion, and the third portion is parallel to both the first and the second portions.
Public/Granted literature
- US20060276013A1 Sequential lateral solidification mask Public/Granted day:2006-12-07
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