Invention Grant
US07879525B2 Chemically amplified photoresist composition, laminated product, and connection element
有权
化学扩增的光致抗蚀剂组合物，层压产品和连接元件
- Patent Title: Chemically amplified photoresist composition, laminated product, and connection element
- Patent Title (中): 化学扩增的光致抗蚀剂组合物，层压产品和连接元件
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Application No.: US10547830Application Date: 2004-12-03
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Publication No.: US07879525B2Publication Date: 2011-02-01
- Inventor: Yasushi Washio , Koji Saito
- Applicant: Yasushi Washio , Koji Saito
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- International Application: PCT/JP2004/018032 WO 20041203
- International Announcement: WO2006/059392 WO 20060608
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/42
Abstract:
There are provided a stable chemically amplified photoresist composition that undergoes no change in alkali solubility prior to irradiation, a photoresist laminated product produced by laminating the photoresist composition onto a support, and a manufacturing method for a photoresist pattern and a manufacturing method for a connection terminal that use the photoresist composition and the laminated product. A chemically amplified photoresist composition is provided comprising (a) a resin that undergoes a change in alkali solubility under the action of acid, (b) a compound that generates acid on irradiation, and (c) a corrosion inhibitor.
Public/Granted literature
- US20070275320A1 Chemically Amplified Photorestist Composition, Laminated Product, and Connection Element Public/Granted day:2007-11-29
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