Invention Grant
US07879529B2 Material for formation of resist protection film and method of forming resist pattern therewith
失效
用于形成抗蚀剂保护膜的材料及其形成抗蚀剂图案的方法
- Patent Title: Material for formation of resist protection film and method of forming resist pattern therewith
- Patent Title (中): 用于形成抗蚀剂保护膜的材料及其形成抗蚀剂图案的方法
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Application No.: US11658900Application Date: 2005-07-29
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Publication No.: US07879529B2Publication Date: 2011-02-01
- Inventor: Kotaro Endo , Masaaki Yoshida , Keita Ishizuka
- Applicant: Kotaro Endo , Masaaki Yoshida , Keita Ishizuka
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2004-224810 20040730; JP2004-228695 20040804
- International Application: PCT/JP2005/013975 WO 20050729
- International Announcement: WO2006/011606 WO 20060202
- Main IPC: G03F7/11
- IPC: G03F7/11 ; G03F7/26 ; C07D265/00 ; C07D285/00

Abstract:
In the liquid immersion lithography process, by simultaneously preventing deterioration of a resist film and deterioration of an immersion liquid employed during liquid immersion lithography which uses various immersion liquids, including water, resistance to post exposure delay of the resist film can be improved without increasing the number of processes, thereby making it possible to form a high resolution resist pattern using liquid immersion lithography. Furthermore, it is possible to apply a high refractive index liquid immersion medium, used in combination with the high refractive index liquid immersion medium, thus making it possible to further improve pattern accuracy. Using a composition comprising an acrylic resin component having characteristics which have substantially no compatibility with a liquid in which a resist film is immersed, particularly water, and are also soluble in alkaline, a protective film is formed on the surface of a resist film used.
Public/Granted literature
- US20080311523A1 Material for Formation of Resist Protection Film and Method of Forming Resist Pattern Therewith Public/Granted day:2008-12-18
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