Invention Grant
US07879535B2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material 失效
图案形成方法,接枝图案材料,导电图案形成方法和导电图案材料

  • Patent Title: Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
  • Patent Title (中): 图案形成方法,接枝图案材料,导电图案形成方法和导电图案材料
  • Application No.: US11090593
    Application Date: 2005-03-28
  • Publication No.: US07879535B2
    Publication Date: 2011-02-01
  • Inventor: Takeyoshi KanoKoichi Kawamura
  • Applicant: Takeyoshi KanoKoichi Kawamura
  • Applicant Address: JP Tokyo
  • Assignee: FUJIFILM Corporation
  • Current Assignee: FUJIFILM Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2004-093726 20040326; JP2004-093727 20040326; JP2004-093728 20040326; JP2004-163786 20040601
  • Main IPC: G03F1/00
  • IPC: G03F1/00
Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
Abstract:
The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly bonded to the base material surface and having at least a group selected from a group consisting of: a polar group; a functional group whose hydrophilicity/hydrophobicity changes, whose structure is changed into a structure that interacts with an electroless plating catalyst or a precursor thereof, or which ceases to interact with an electroless plating catalyst or a precursor thereof in response to heat, acid or radiation; and a polymerizable functional group, is generated in a pattern shape using the active site as a starting point so that a pattern is formed on the surface of the base material.
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