Invention Grant
- Patent Title: Structure and manufacturing method of semiconductor memory device
- Patent Title (中): 半导体存储器件的结构和制造方法
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Application No.: US11274258Application Date: 2005-11-16
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Publication No.: US07879626B2Publication Date: 2011-02-01
- Inventor: Tetsuya Ohnishi , Naoyuki Shinmura , Shinobu Yamazaki , Takahiro Shibuya , Takashi Nakano , Masayuki Tajiri , Shigeo Ohnishi
- Applicant: Tetsuya Ohnishi , Naoyuki Shinmura , Shinobu Yamazaki , Takahiro Shibuya , Takashi Nakano , Masayuki Tajiri , Shigeo Ohnishi
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2004-333130 20041117
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor memory device having a cross point structure includes a plurality of upper electrodes arranged to extend in one direction, and a plurality of lower electrodes arranged to extend in another direction at a right angle to the one direction of the upper electrodes. Memory materials are provided between the upper electrodes and the lower electrodes for storage of data. The memory materials are made of a perovskite material and arranged at the lower electrodes side of the corresponding upper electrode extending along the corresponding upper electrode.
Public/Granted literature
- US20060102943A1 Structure and manufacturing method of semiconductor memory device Public/Granted day:2006-05-18
Information query
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