Invention Grant
- Patent Title: Overlay marks and methods of manufacturing such marks
- Patent Title (中): 覆盖标记和制造这种标记的方法
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Application No.: US12533295Application Date: 2009-07-31
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Publication No.: US07879627B2Publication Date: 2011-02-01
- Inventor: Mark Ghinovker , Michael Adel , Walter D. Mieher , Ady Levy , Dan Wack
- Applicant: Mark Ghinovker , Michael Adel , Walter D. Mieher , Ady Levy , Dan Wack
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Weaver Austin Villenueve & Sampson LLP
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66

Abstract:
An overlay mark for determining the relative shift between two or more successive layers of a substrate and methods for using such overlay mark are disclosed. In one embodiment, the overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern includes a first set of working zones and a second set of working zones. The first set of working zones are disposed on a first layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The second set of working zones are disposed on a second layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The first set of working zones are generally angled relative to the second set of working zones thus forming an “X” shaped test pattern.
Public/Granted literature
- US20090291513A1 OVERLAY MARKS, METHODS OF OVERLAY MARK DESIGN AND METHODS OF OVERLAY MEASUREMENTS Public/Granted day:2009-11-26
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