Invention Grant
US07879633B2 Miniature optical element for wireless bonding in an electronic instrument
有权
微型光学元件，用于电子仪器中的无线键合
- Patent Title: Miniature optical element for wireless bonding in an electronic instrument
- Patent Title (中): 微型光学元件，用于电子仪器中的无线键合
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Application No.: US12453301Application Date: 2009-05-06
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Publication No.: US07879633B2Publication Date: 2011-02-01
- Inventor: Kenji Wada
- Applicant: Kenji Wada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2000-209352 20000711; JP2001-165017 20010531
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
Public/Granted literature
- US20090221108A1 Miniature optical element for wireless bonding in an electronic instrument Public/Granted day:2009-09-03
Information query
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