A structure and method for fabricating imagers that detect light from the backside of the wafer. The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging. The fabrication of the imager includes forming an imaging device on a silicon wafer, adhering an interconnect wafer to the device wafer, forming interconnects on the interconnect wafer, etching away the substrate of the device wafer, and patterning additional layers such as nitrides, color filter arrays, and lenses on the backside of the device wafer.