Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12040224Application Date: 2008-02-29
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Publication No.: US07879658B2Publication Date: 2011-02-01
- Inventor: Yoshio Ozawa , Ichiro Mizushima , Takashi Suzuki , Hirokazu Ishida , Yoshitaka Tsunashima
- Applicant: Yoshio Ozawa , Ichiro Mizushima , Takashi Suzuki , Hirokazu Ishida , Yoshitaka Tsunashima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2007-051792 20070301
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/04

Abstract:
A semiconductor device includes a silicon crystal layer on an insulating layer, the silicon crystal layer containing a crystal lattice mismatch plane, a memory cell array portion on the silicon crystal layer, the memory cell array portion including memory strings, each of the memory strings including nonvolatile memory cell transistors connected in series in a first direction, the memory strings being arranged in a second direction orthogonal to the first direction, the crystal lattice mismatch plane crossing the silicon crystal along the second direction without passing under gates of the nonvolatile memory cell transistors as viewed from a top of the silicon crystal layer, or crossing the silicon crystal along the first direction with passing under gates of the nonvolatile memory cell transistors as viewed from the top of the silicon crystal layer.
Public/Granted literature
- US20080211004A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-09-04
Information query
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