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US07879689B2 Method of manufacturing a semiconductor device including a semiconductor substrate with stripes of different crystal plane directions 有权
制造包括具有不同晶面方向的条纹的半导体衬底的半导体器件的方法

Method of manufacturing a semiconductor device including a semiconductor substrate with stripes of different crystal plane directions
Abstract:
Manufacturing a semiconductor device with higher operating characteristics and achieve low power consumption of a semiconductor integrated circuit. A single crystal semiconductor layer is formed so that crystal plane directions of single crystal semiconductor layers which are used for channel regions of an n-channel TFT and a p-channel TFT and which are formed over the same plane of the substrate are the most appropriate crystal plane directions for each TFT. In accordance with such a structure, mobility of carrier flowing through a channel is increased and the semiconductor device with higher operating characteristics can be provided. Low voltage driving can be performed, and low power consumption can be achieved.
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