Invention Grant
US07879970B2 Conductive polymer, conductive layer, electronic device, and electronic equipment 有权
导电聚合物,导电层,电子设备和电子设备

  • Patent Title: Conductive polymer, conductive layer, electronic device, and electronic equipment
  • Patent Title (中): 导电聚合物,导电层,电子设备和电子设备
  • Application No.: US11794947
    Application Date: 2006-01-10
  • Publication No.: US07879970B2
    Publication Date: 2011-02-01
  • Inventor: Masamltsu Uehara
  • Applicant: Masamltsu Uehara
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2005-003416 20050111
  • International Application: PCT/JP2006/300407 WO 20060110
  • International Announcement: WO2006/075723 WO 20060720
  • Main IPC: C08F8/32
  • IPC: C08F8/32
Conductive polymer, conductive layer, electronic device, and electronic equipment
Abstract:
A conductive polymer having a high carrier transport ability, a conductive layer formed using the conductive polymer, an electronic device provided with the conductive layer having a high reliability, and electronic equipment provided with such an electronic device are provided. The conductive polymer includes a linear main chain, a plurality of carrier transport structures which contribute to carrier transport and each of which is represented by the following formula (1), and a linking structure which branches off from the main chain to link each of the carrier transport structures to the main chain: General Formula (1) where each R1 independently represents a hydrogen atom, a methyl group or an ethyl group, and the R1s are the same or different.
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