Method and apparatus for improved thermal isolation for thermoelectric devices are disclosed. In one embodiment, a thermoelectric device includes a first substrate portion having a first p-type conductive portion electrically coupled to a first n-type conductive portion, and a second substrate portion having a second p-type conductive portion and a second n-type conductive portion, the second substrate portion being positioned proximate to the first substrate portion such that the first and second p-type conductive portions are approximately aligned and the first and second n-type conductive portions are approximately aligned, wherein the first and second p-type conductive portions are spaced apart to form a first gap, and the first and second n-type conductive portions are spaced apart to form a second gap.