Invention Grant
- Patent Title: Electronic device substrate, electronic device and methods for making same
- Patent Title (中): 电子器件基板，电子器件及其制造方法
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Application No.: US11645948Application Date: 2006-12-27
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Publication No.: US07880091B2Publication Date: 2011-02-01
- Inventor: Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- Applicant: Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- Applicant Address: JP Tokyo JP Kanagawa
- Assignee: Hitachi Cable, Ltd.,Renesas Electronics Corporation
- Current Assignee: Hitachi Cable, Ltd.,Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo JP Kanagawa
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JP2006-141862 20060522
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
Public/Granted literature
- US20070269590A1 Electronic device substrate, electronic device and methods for making same Public/Granted day:2007-11-22
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