A substrate for embodying multi-package comprises an underlying layer has a polymer material containing a conductive filler and provided with a step-like groove divided into step part and bottom part; a coating layer formed over the underlying layer, the coating layer is formed so that it may define a metal-wire forming area on the step part and the bottom part of the step-like groove and the conductive filler in the metal-wire forming area is exposed; and a metal wire formed via a plating process using the exposed conductive filler in the metal-wire forming area defined by the coating layer as a seed layer.