Invention Grant
- Patent Title: Switch assembly constructions
- Patent Title (中): 开关总成结构
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Application No.: US11824191Application Date: 2007-06-28
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Publication No.: US07880106B2Publication Date: 2011-02-01
- Inventor: Adam Duckworth Middleman , Tang Yew Tan , Erik L. Wang , Richard Hung Minh Dinh , Phillip Michael Hobson , Kenneth A. Jenks
- Applicant: Adam Duckworth Middleman , Tang Yew Tan , Erik L. Wang , Richard Hung Minh Dinh , Phillip Michael Hobson , Kenneth A. Jenks
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: H01H5/18
- IPC: H01H5/18

Abstract:
Electronic devices are provided with switch assembly input components that can have adhesives adhered to the side and/or bottom surfaces of support plates for retaining switches between the adhesives and the tops of the support plates. The switch assembly input components can include buttons with one or more absorption elements for receiving impact energy, reducing the impact energy, and transferring the reduced impact energy onto the switches.
Public/Granted literature
- US20090000931A1 Switch assembly constructions Public/Granted day:2009-01-01
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