Invention Grant
- Patent Title: Method and apparatus for material processing
- Patent Title (中): 材料加工方法和装置
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Application No.: US11401114Application Date: 2006-04-10
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Publication No.: US07880114B2Publication Date: 2011-02-01
- Inventor: Paul E. Denney , Jay R. Eastman , Paul M. Fallara , Andrew P. Joseph , John S. Phillips , Ta-Chieh Huang , Michael N. Patena , Tim Burnham , Paul Coleman
- Applicant: Paul E. Denney , Jay R. Eastman , Paul M. Fallara , Andrew P. Joseph , John S. Phillips , Ta-Chieh Huang , Michael N. Patena , Tim Burnham , Paul Coleman
- Applicant Address: US CA Loma Linda
- Assignee: Loma Linda University Medical Center
- Current Assignee: Loma Linda University Medical Center
- Current Assignee Address: US CA Loma Linda
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.
Public/Granted literature
- US20060278620A1 Method and apparatus for material processing Public/Granted day:2006-12-14
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