Invention Grant
US07880226B2 Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
有权
具有半导体主体的集成电路装置和用于生产集成电路装置的方法
- Patent Title: Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
- Patent Title (中): 具有半导体主体的集成电路装置和用于生产集成电路装置的方法
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Application No.: US12020077Application Date: 2008-01-25
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Publication No.: US07880226B2Publication Date: 2011-02-01
- Inventor: Uli Hiller , Oliver Blank , Ralf Siemieniec , Maximilian Roesch
- Applicant: Uli Hiller , Oliver Blank , Ralf Siemieniec , Maximilian Roesch
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102007061191 20071217
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.
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