Invention Grant
- Patent Title: Low-temperature electrically activated gate electrode and method of fabricating same
- Patent Title (中): 低温电活化栅电极及其制造方法
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Application No.: US11678338Application Date: 2007-02-23
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Publication No.: US07880241B2Publication Date: 2011-02-01
- Inventor: John C. Arnold , Stephen W. Bedell , Keith E. Fogel , Devendra K. Sadana
- Applicant: John C. Arnold , Stephen W. Bedell , Keith E. Fogel , Devendra K. Sadana
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A gate electrode structure is provided, which includes, from bottom to top, an optional, yet preferred metallic layer, a Ge rich-containing layer and a Si rich-containing layer. The sidewalls of the Ge rich-containing layer include a surface passivation layer. The inventive gate electrode structure serves as a low-temperature electrically activated gate electrode of a MOSFET in which the materials thereof as well as the method of fabricating the same are compatible with existing MOSFET fabrication techniques. The inventive gate electrode structure is electrically activated at low processing temperatures (on the order of less than 750° C.). Additionally, the inventive gate electrode structure also minimizes gate-depletion effects, does not contaminate a standard MOS fabrication facility and has sufficiently low reactivity of the exposed surfaces that renders such a gate electrode structure compatible with conventional MOSFET processing steps.
Public/Granted literature
- US20080203447A1 LOW-TEMPERATURE ELECTRICALLY ACTIVATED GATE ELECTRODE AND METHOD OF FABRICATING SAME Public/Granted day:2008-08-28
Information query
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