Invention Grant
- Patent Title: Integrated circuit including a capacitor and method
- Patent Title (中): 集成电路包括电容器和方法
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Application No.: US12056625Application Date: 2008-03-27
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Publication No.: US07880269B2Publication Date: 2011-02-01
- Inventor: Frank Heinrichsdorff , Steffen Meyer , Jens Schmidt
- Applicant: Frank Heinrichsdorff , Steffen Meyer , Jens Schmidt
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
An integrated circuit including a capacitor and a method of fabricating an integrated circuit. The capacitor has a first electrode. A plurality of conductive lines is separated from each other and is configured to be held at a potential being the same for all conductive lines. A second electrode encloses individual ones of the conductive lines at a top side and at least one lateral side and is separated from the first electrode by a dielectric layer. The second electrode includes a polycrystalline semiconductor material, a metal or a metal-semiconductor compound.
Public/Granted literature
- US20090242952A1 INTEGRATED CIRCUIT INCLUDING A CAPACITOR AND METHOD Public/Granted day:2009-10-01
Information query
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